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体育外围平台

      体育外围平台

      Shin-Etsu die attach materials come in two types : epoxy and silicone type. Epoxy based B stage material is a high purity insulating die attach material developed for stencil or screen printing. It has excellent releasability, shape retention, storage stability at B stage status(semi-cured status with no tack appearance). After chip bonding, it can be re-melted by heating at high temperature and treated like thermal curing. It shows very low stress after curing.

      Applications

      • Semiconductor device
      电竞外围投注平台
      For Inquiries About This Product
      • Company:
        Shin-Etsu Chemical Co., Ltd.
      • Department:
        Electronics Materials Division, Organic Electronics Materials Dept.
      • Phone:
        +81-3-3246-5231
          十大外围投注平台app6778689
          baiduxml 体育外围「官网」